Data provided by National Institute of Standards and Technology
The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, Florida, May 30 - June 2, 2023. https://doi.org/10.1109/ECTC51909.2023.00225
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Updated: 2026-08-20
Metadata Last Updated:
2023-03-01 00:00:00
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| Title | Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan |
|---|---|
| Description | The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, Florida, May 30 - June 2, 2023. https://doi.org/10.1109/ECTC51909.2023.00225 |
| Modified | 2023-03-01 00:00:00 |
| Publisher Name | National Institute of Standards and Technology |
| Contact | mailto:[email protected] |
| Keywords | differential scanning calorimetry , thermal gravimetric analysis , heat of reaction , glass transition , thermosets , filled polymers , advanced packaging , semiconductors |
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