{
    "identifier": "ark:\/88434\/mds2-2948",
    "accessLevel": "public",
    "contactPoint": {
        "hasEmail": "mailto:[email protected]",
        "fn": "Aaron M. Forster"
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    "programCode": [
        "006:045"
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    "landingPage": "https:\/\/data.nist.gov\/od\/id\/mds2-2948",
    "title": "Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan",
    "description": "The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, Florida, May 30 - June 2, 2023. https:\/\/doi.org\/10.1109\/ECTC51909.2023.00225",
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            "title": "README"
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    "bureauCode": [
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    "modified": "2023-03-01 00:00:00",
    "publisher": {
        "@type": "org:Organization",
        "name": "National Institute of Standards and Technology"
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    "theme": [
        "Chemistry:Thermochemical properties",
        "Chemistry:Analytical chemistry",
        "Chemistry:Chemical engineering and processing",
        "Materials:Polymers",
        "Materials:Composites",
        "Materials:Materials characterization"
    ],
    "keyword": [
        "differential scanning calorimetry",
        "thermal gravimetric analysis",
        "heat of reaction",
        "glass transition",
        "thermosets",
        "filled polymers",
        "advanced packaging",
        "semiconductors"
    ]
}