{
    "identifier": "ark:\/88434\/mds2-3698",
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    "contactPoint": {
        "hasEmail": "mailto:[email protected]",
        "fn": "Alexander Landauer"
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    "programCode": [
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    "landingPage": "https:\/\/data.nist.gov\/od\/id\/mds2-3698",
    "title": "Data for Advanced Metrology Suite for Linking Residual Stress to Fundamental\nProperties of Thermoset Packaging Materials",
    "description": "This repository contains data generated to support and ECTC 2025 conference manuscript titled \"Advanced Metrology Suite for Linking Residual Stress to Fundamental Properties of Thermoset Packaging Materials\". It contains differential scanning calorimetry (DSC), rheology, digital image correlation (DIC), vapor uptake, and stress bench data on and example commercially available encapsulant epoxy material. The goal of the study and data is to (a) demonstrate these techniques, and (b) better understand the cure kinetics, liquid-to-solid transition, and residual stresses in for this material system. More complete descriptions of the methods and finding are available in the associated manuscript.\n\nThe dataset contain about 2.5 GB of data, most of which by size is DIC images in .7z compressed folders. Most data is provided in .csv, .xslx, and .mat files. Resultant figures are included for reference in .png, .tiff or similar formats.",
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            "description": "The CADRE website provides an access point to the project\u2019s published datasets. It aims to provide researchers a means to quickly understand the scope of the work and explore data relevant to semiconductor packaging materials and processing.",
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            "mediaType": "application\/vnd.openxmlformats-officedocument.spreadsheetml.sheet",
            "title": "_hold\/DSC_data\/Figure 2a-sum pf peaks rate 10_MIDAS"
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            "title": "_hold\/DSC_data\/Figure 2b-schedule 1_MIDAS"
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            "mediaType": "text\/csv",
            "title": "Stress_bench_data\/Fig 4c - Industry collaborator stress measurements"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-3698\/Stress_bench_data%2FFig%204c%20-%20Industry%20collaborator%20stress%20measurements.png",
            "mediaType": "image\/png",
            "title": "Stress_bench_data\/Fig 4c - Industry collaborator stress measurements"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-3698\/Stress_bench_data%2FFig%205d%20-%20Stress%20in%20conditioned%20thin%20film.csv",
            "mediaType": "text\/csv",
            "title": "Stress_bench_data\/Fig 5d - Stress in conditioned thin film"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-3698\/Stress_bench_data%2FFig%205d%20-%20Stress%20in%20conditioned%20thin%20film.png",
            "mediaType": "image\/png",
            "title": "Stress_bench_data\/Fig 5d - Stress in conditioned thin film"
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    ],
    "bureauCode": [
        "006:55"
    ],
    "modified": "2025-01-30 00:00:00",
    "publisher": {
        "@type": "org:Organization",
        "name": "National Institute of Standards and Technology"
    },
    "theme": [
        "Materials:Materials characterization",
        "Materials:Polymers",
        "Metrology:Flow metrology and rheology",
        "Metrology:Optical, photometry, and laser metrology"
    ],
    "keyword": [
        "Encapsulant",
        "cure kinetics",
        "cure shrinkage",
        "residual stress",
        "digital image correlation",
        "rheology",
        "differential scanning calorimetry",
        "vapor saturation",
        "thin film stress",
        "epoxy"
    ]
}