Data provided by National Institute of Standards and Technology
Included here are figures and other relevant data from the paper "Characterizing Interconnects to 325 GHz". Abstract: We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line calibration and subsequently de-embeds the interconnect with a multi-tiered calibration. We experimentally validated our method with distributed contactless interconnects in the form of broadside coupled coplanar waveguides as a test case. We find excellent agreement between experiment, full-wave simulations, and a distributed model of contactless interconnects. This work provides a rigorous method to accurately characterize interconnects when conventional approaches are not applicable.
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Updated: 2025-04-06
Metadata Last Updated:
2023-09-21 00:00:00
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| Title | Data for "Characterizing Interconnects to 325 GHz" to be submitted to "Transactions on Microwave Theory and Techniques" |
|---|---|
| Description | Included here are figures and other relevant data from the paper "Characterizing Interconnects to 325 GHz". Abstract: We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line calibration and subsequently de-embeds the interconnect with a multi-tiered calibration. We experimentally validated our method with distributed contactless interconnects in the form of broadside coupled coplanar waveguides as a test case. We find excellent agreement between experiment, full-wave simulations, and a distributed model of contactless interconnects. This work provides a rigorous method to accurately characterize interconnects when conventional approaches are not applicable. |
| Modified | 2023-09-21 00:00:00 |
| Publisher Name | National Institute of Standards and Technology |
| Contact | mailto:[email protected] |
| Keywords | on-wafer calibration , multiline TRL , heterogeneous interconnect , broadside-coupled coplanar waveguide , distributed circuit model , de-embedding |
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"title": "Data for \"Characterizing Interconnects to 325 GHz\" to be submitted to \"Transactions on Microwave Theory and Techniques\"",
"description": "Included here are figures and other relevant data from the paper \"Characterizing Interconnects to 325 GHz\". Abstract: We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line calibration and subsequently de-embeds the interconnect with a multi-tiered calibration. We experimentally validated our method with distributed contactless interconnects in the form of broadside coupled coplanar waveguides as a test case. We find excellent agreement between experiment, full-wave simulations, and a distributed model of contactless interconnects. This work provides a rigorous method to accurately characterize interconnects when conventional approaches are not applicable.",
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