Data provided by National Institute of Standards and Technology
This dataset contains Brillouin light scattering (BLS) and low-frequency Raman (LFR) spectroscopy measurements as collected using a custom-built microscope and spectrometer platform. The platform is used to investigate the mechanical properties of semiconductor packaging materials. This dual-mode microscope is capable of both in situ temporal and hyperspectral imaging acquisition modes. The in situ temporal mode is used to monitor the cure of an epoxy sample as well as post-cure temperature cycling to probe the mechanical properties and glass transition temperature of polymers. The hyperspectral imaging mode is used to analyze a multicomponent sample which is representative of a material with multiple degrees of cure. The primary material which is investigated is a bisphenol A diglycidyl ether (DGEBA)-based epoxy cured with various curing agents.
This dataset accompanies a publication (S. Engmann et al. 2025 IEEE ECTC, doi: 10.1109/ECTC51687.2025.00288) which contains figures displaying this data.
About this Dataset
Updated: 2026-09-19
Metadata Last Updated:
2025-02-27 00:00:00
Date Created:
N/A
Data Provided by:
Dataset Owner:
N/A
| Title | Data for A Dual Mode Brillouin/Low-Frequency Raman Spectroscopy Microscope for Local Mechanical Property Imaging for Semiconductor Packaging Materials |
|---|---|
| Description | This dataset contains Brillouin light scattering (BLS) and low-frequency Raman (LFR) spectroscopy measurements as collected using a custom-built microscope and spectrometer platform. The platform is used to investigate the mechanical properties of semiconductor packaging materials. This dual-mode microscope is capable of both in situ temporal and hyperspectral imaging acquisition modes. The in situ temporal mode is used to monitor the cure of an epoxy sample as well as post-cure temperature cycling to probe the mechanical properties and glass transition temperature of polymers. The hyperspectral imaging mode is used to analyze a multicomponent sample which is representative of a material with multiple degrees of cure. The primary material which is investigated is a bisphenol A diglycidyl ether (DGEBA)-based epoxy cured with various curing agents. This dataset accompanies a publication (S. Engmann et al. 2025 IEEE ECTC, doi: 10.1109/ECTC51687.2025.00288) which contains figures displaying this data. |
| Modified | 2025-02-27 00:00:00 |
| Publisher Name | National Institute of Standards and Technology |
| Contact | mailto:[email protected] |
| Keywords | Brillouin light scattering spectroscopy , low-frequency Raman spectroscopy , microscopy , in situ , kinetics , mechanical properties , packaging polymers |
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