The data are associated with figures in R. Giang, R. Tao,*, E. Moukhina, A. L. Forster, T. J. Cho, P. Centellas, S. Romberg, Z. Tsinas, C. Soles, Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging, Journal of Polymer Science 2026, https://doi.org/10.1002/pola.70283
About this Dataset
| Title | Data for Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging |
|---|---|
| Description | The data are associated with figures in R. Giang, R. Tao,*, E. Moukhina, A. L. Forster, T. J. Cho, P. Centellas, S. Romberg, Z. Tsinas, C. Soles, Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging, Journal of Polymer Science 2026, https://doi.org/10.1002/pola.70283 |
| Modified | 2026-07-24 00:00:00 |
| Publisher Name | National Institute of Standards and Technology |
| Contact | mailto:[email protected] |
| Keywords | advanced electronic packaging , cure kinetics , differential scanning calorimetry , diffusion-controlled reaction , epoxy underfill , isoconversional analysis , thermal endurance , thermogravimetric analysis , vitrification |
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"title": "Data for Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging",
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