Data provided by National Institute of Standards and Technology
This publication contains the data presented in the associated proceeding paper ”Pushing the Envelope in Mechanical Characterization of Copper in Hybrid-Bonding Patterns for Advanced Packaging: from Instrumented Indentation to Multimodal Atomic Force Microscopy” submitted for publication in the proceedings of the 2026 IEEE 76th Electronic Components and Technology Conference.
The datasets were obtained in single-step and multi-step indentations using instrumented indentation (IIT) and atomic force microscope (AFM) on hybrid-bonding copper at room temperature.
About this Dataset
Updated: 2026-09-04
Metadata Last Updated:
2026-02-02 00:00:00
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| Title | Elastic-plastic Single-Step and Multi-Step Indentation via IIT and AFM on Hybrid Bonding Copper |
|---|---|
| Description | This publication contains the data presented in the associated proceeding paper ”Pushing the Envelope in Mechanical Characterization of Copper in Hybrid-Bonding Patterns for Advanced Packaging: from Instrumented Indentation to Multimodal Atomic Force Microscopy” submitted for publication in the proceedings of the 2026 IEEE 76th Electronic Components and Technology Conference. The datasets were obtained in single-step and multi-step indentations using instrumented indentation (IIT) and atomic force microscope (AFM) on hybrid-bonding copper at room temperature. |
| Modified | 2026-02-02 00:00:00 |
| Publisher Name | National Institute of Standards and Technology |
| Contact | mailto:[email protected] |
| Keywords | AFM , instrumented indentation , copper , plasticity , yield strength , stress-strain curve , hybrid bonding , advanced packaging |
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"title": "Elastic-plastic Single-Step and Multi-Step Indentation via IIT and AFM on Hybrid Bonding Copper",
"description": "This publication contains the data presented in the associated proceeding paper \u201dPushing the Envelope in Mechanical Characterization of Copper in Hybrid-Bonding Patterns for Advanced Packaging: from Instrumented Indentation to Multimodal Atomic Force Microscopy\u201d submitted for publication in the proceedings of the 2026 IEEE 76th Electronic Components and Technology Conference. \nThe datasets were obtained in single-step and multi-step indentations using instrumented indentation (IIT) and atomic force microscope (AFM) on hybrid-bonding copper at room temperature.",
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