Data provided by National Institute of Standards and Technology
Included here are figures and other relevant data from the paper "A distributed theory for contactless interconnects at terahertz frequencies". Abstract: Here we test a multimodal model for distributed contactless interconnects by comparing it to 3D full-wave simulations. In comparison to 3D simulations, the model offers insight into how the interconnect works and reduces the computational cost of estimating the interconnect?s performance. We predict the performance of four distributed contactless interconnects and find good agreement between our multimodal model and 3D simulations up to 1 THz. All the interconnects have less than 1 dB insertion loss in their first pass bands, highlighting the opportunity offered by contactless interconnects.
About this Dataset
Updated: 2025-04-06
Metadata Last Updated:
2022-12-15 00:00:00
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| Title | Data for "A distributed theory for contactless interconnects at terahertz frequencies" |
|---|---|
| Description | Included here are figures and other relevant data from the paper "A distributed theory for contactless interconnects at terahertz frequencies". Abstract: Here we test a multimodal model for distributed contactless interconnects by comparing it to 3D full-wave simulations. In comparison to 3D simulations, the model offers insight into how the interconnect works and reduces the computational cost of estimating the interconnect?s performance. We predict the performance of four distributed contactless interconnects and find good agreement between our multimodal model and 3D simulations up to 1 THz. All the interconnects have less than 1 dB insertion loss in their first pass bands, highlighting the opportunity offered by contactless interconnects. |
| Modified | 2022-12-15 00:00:00 |
| Publisher Name | National Institute of Standards and Technology |
| Contact | mailto:[email protected] |
| Keywords | On-Wafer , microwave , amplifier , photomixers , frequency combiner , frequency comb , electronics , terahertz |
{
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"fn": "Nick Jungwirth"
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"landingPage": "https:\/\/data.nist.gov\/od\/id\/mds2-2773",
"title": "Data for \"A distributed theory for contactless interconnects at terahertz frequencies\"",
"description": "Included here are figures and other relevant data from the paper \"A distributed theory for contactless interconnects at terahertz frequencies\". Abstract: Here we test a multimodal model for distributed contactless interconnects by comparing it to 3D full-wave simulations. In comparison to 3D simulations, the model offers insight into how the interconnect works and reduces the computational cost of estimating the interconnect?s performance. We predict the performance of four distributed contactless interconnects and find good agreement between our multimodal model and 3D simulations up to 1 THz. All the interconnects have less than 1 dB insertion loss in their first pass bands, highlighting the opportunity offered by contactless interconnects.",
"language": [
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"distribution": [
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"downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-2773\/Fig3_TableI_Data.xlsx",
"mediaType": "application\/vnd.openxmlformats-officedocument.spreadsheetml.sheet",
"title": "Scattering parameters of distributed contactless interconnect"
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"mediaType": "application\/vnd.openxmlformats-officedocument.spreadsheetml.sheet",
"title": "Simulated distributed circuit parameters"
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"downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-2773\/Fig1.tif",
"description": "(a) 3D design of broadside-coupled CPWs and associated two-port network model of the interconnect. (b) Cross-sectional geometry of the translucent plane in (a). Distributed circuit model in the conductor representation (c) and modal representation (d) for N=2 coupled lines.",
"mediaType": "image\/tiff",
"title": "Figure 1"
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"description": "Conductor-representation distributed circuit parameters of resistance (a), inductance (b), conductance (c) and capacitance (d) per unit length.",
"mediaType": "image\/tiff",
"title": "Figure 2"
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"downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-2773\/Fig3.tif",
"description": "Interconnect transmission (S_12) predicted by full-wave simulations (red curves) and our analytical, parameter-free, two-mode model (dashed curves) for l_c= 500 \u00b5m (a), 250 \u00b5m (b), 125 \u00b5m (c), and 60 \u00b5m (d). The transmission band maxima (f_n) and bandwidth (?f_n) increase as the coupling length decreases.",
"mediaType": "image\/tiff",
"title": "Figure 3"
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"downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-2773\/README.txt",
"description": "A readme document for data submitted for \"A distributed theory for contactless interconnects at terahertz frequencies\".",
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"modified": "2022-12-15 00:00:00",
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"name": "National Institute of Standards and Technology"
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"theme": [
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"keyword": [
"On-Wafer",
"microwave",
"amplifier",
"photomixers",
"frequency combiner",
"frequency comb",
"electronics",
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