This data repository is the basis for the figures in the manuscript "A Fabrication-motivated Model for Improving Simulations of On-wafer Transmission Lines", F. Bergmann et al. (2026), accepted for publications in IEEE MWTL. The abstract is as follows:
Electromagnetic simulations are a ubiquitous tool for microwave engineers. We benchmark simulations by their agreement with experimental results. Transmission lines are an excellent test case because they have well-established measurement methodologies and are straightforward to simulate. However, when disagreements between simulation and experiment arise, finding the root cause can be quite difficult due to the number of design parameters. Here, we investigated a fabrication-motivated model that reduces this complexity by leveraging correlations between transmission line design parameters. We validated our model by comparing its prediction of cross-sectional geometry to scanning electron microscopy measurements. Our procedure provides a simple path for microwave engineers to improve simulations on a broad range of on-wafer devices.
About this Dataset
| Title | A fabrication-motivated model for improving simulations of on-wafer transmission lines |
|---|---|
| Description | This data repository is the basis for the figures in the manuscript "A Fabrication-motivated Model for Improving Simulations of On-wafer Transmission Lines", F. Bergmann et al. (2026), accepted for publications in IEEE MWTL. The abstract is as follows: Electromagnetic simulations are a ubiquitous tool for microwave engineers. We benchmark simulations by their agreement with experimental results. Transmission lines are an excellent test case because they have well-established measurement methodologies and are straightforward to simulate. However, when disagreements between simulation and experiment arise, finding the root cause can be quite difficult due to the number of design parameters. Here, we investigated a fabrication-motivated model that reduces this complexity by leveraging correlations between transmission line design parameters. We validated our model by comparing its prediction of cross-sectional geometry to scanning electron microscopy measurements. Our procedure provides a simple path for microwave engineers to improve simulations on a broad range of on-wafer devices. |
| Modified | 2026-02-12 00:00:00 |
| Publisher Name | National Institute of Standards and Technology |
| Contact | mailto:[email protected] |
| Keywords | Circuit parameters , coplanar waveguide , finite-element simulations , impedance , on-wafer , transmission lines |
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