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Data for A Switchable Longitudinal & Shear BLS Microscope for Comprehensive Modulus Imaging of Semiconductor Packaging Materials

This dataset contains Brillouin light scattering (BLS) measurements collected using a custom-built switchable microscope and spectrometer platform. The microscope has two configurations: 1) a backscattered mode for high resolution longitudinal BLS measurements, and 2) an off-axis mode for longitudinal and shear measurements. The microscope can be used for comprehensive modulus imaging, including longitudinal modulus, Young's modulus, shear modulus, bulk modulus, and Poisson's ratio. In this dataset, the platform is used to characterize two proof-of-concept heterogeneous samples with relevance to semiconductor packaging materials: 1) a bisphenol F diglycidyl ether/diethyl toluene diamine (DEGBF/DETDA)-based polymer (TM-1) with two different degrees of cure, and 2) a bisphenol A diglycidyl ether (DGEBA)-based polymer with silica filler particles present. The modulus values collected using BLS can be compared to results from conventional modulus characterization techniques, including nanoindentation and dynamic mechanical analysis.

About this Dataset

Updated: 2026-09-04
Metadata Last Updated: 2026-04-03 00:00:00
Date Created: N/A
Data Provided by:
Dataset Owner: N/A

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Title Data for A Switchable Longitudinal & Shear BLS Microscope for Comprehensive Modulus Imaging of Semiconductor Packaging Materials
Description This dataset contains Brillouin light scattering (BLS) measurements collected using a custom-built switchable microscope and spectrometer platform. The microscope has two configurations: 1) a backscattered mode for high resolution longitudinal BLS measurements, and 2) an off-axis mode for longitudinal and shear measurements. The microscope can be used for comprehensive modulus imaging, including longitudinal modulus, Young's modulus, shear modulus, bulk modulus, and Poisson's ratio. In this dataset, the platform is used to characterize two proof-of-concept heterogeneous samples with relevance to semiconductor packaging materials: 1) a bisphenol F diglycidyl ether/diethyl toluene diamine (DEGBF/DETDA)-based polymer (TM-1) with two different degrees of cure, and 2) a bisphenol A diglycidyl ether (DGEBA)-based polymer with silica filler particles present. The modulus values collected using BLS can be compared to results from conventional modulus characterization techniques, including nanoindentation and dynamic mechanical analysis.
Modified 2026-04-03 00:00:00
Publisher Name National Institute of Standards and Technology
Contact mailto:[email protected]
Keywords Brillouin light scattering spectroscopy , microscopy , mechanical properties , packaging polymers
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    "bureauCode": [
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    "modified": "2026-04-03 00:00:00",
    "publisher": {
        "@type": "org:Organization",
        "name": "National Institute of Standards and Technology"
    },
    "theme": [
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        "Metrology:Optical, photometry, and laser metrology",
        "Physics:Spectroscopy"
    ],
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        "microscopy",
        "mechanical properties",
        "packaging polymers"
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}