Data provided by National Institute of Standards and Technology
This repository contains data from multiple modalities used to study the effect of reaction conditions on the cure of a thermosetting epoxy. The material is a model thermoset system (TM01) of bisphenol F diglycidyl ether (DGEBF) epoxy resin and diethyl toluene diamine (DETDA) curing agent mixed in a stoichiometric ratio.
Data sources:
- CP_data_CKM: Conversion Prediction (CP) data from the Cure Kinetics Modeling (CKM) of the reaction process, consisting of the exported data from the model results.
- CP_data_DSC: Data from the Differential Scanning Calorimetry (DSC) scans on the uncured material. Reduced data in .xlsx files from DSC experiments.
- CTE_data_DIC: Data for Coefficient of Thermal Expansion (CTE) from the digital image correlation (DIC) experiment, including DIC data output (.csv) and processed results (.mat).
- CTE_data_SBA: Data for CTE from the Stress Bench Analysis (SBA).
- CTE_data_TMA: Data for CTE from thermomechanical analysis (TMA) of the material.
- DR_data_MRC: Data for the Dielectric Response of the material using a non-contact Microwave Resonant Cavity (MRC) at 7 GHz.
- MP_data_VSA: Data on the Moisture Properties (MP) of the material collected with an isothermal Vapor Sorption Analyzer.
- RS_data_SBA: Residual Stress (RS) data from the SBA.
For more details see the included documentation in the main folder and subfolders.
About this Dataset
Updated: 2026-09-04
Metadata Last Updated:
2026-05-12 00:00:00
Date Created:
N/A
Data Provided by:
Dataset Owner:
N/A
| Title | Data for Controlling the Reaction Pathway to Tune Packaging Epoxy Properties |
|---|---|
| Description | This repository contains data from multiple modalities used to study the effect of reaction conditions on the cure of a thermosetting epoxy. The material is a model thermoset system (TM01) of bisphenol F diglycidyl ether (DGEBF) epoxy resin and diethyl toluene diamine (DETDA) curing agent mixed in a stoichiometric ratio. Data sources: - CP_data_CKM: Conversion Prediction (CP) data from the Cure Kinetics Modeling (CKM) of the reaction process, consisting of the exported data from the model results. - CP_data_DSC: Data from the Differential Scanning Calorimetry (DSC) scans on the uncured material. Reduced data in .xlsx files from DSC experiments. - CTE_data_DIC: Data for Coefficient of Thermal Expansion (CTE) from the digital image correlation (DIC) experiment, including DIC data output (.csv) and processed results (.mat). - CTE_data_SBA: Data for CTE from the Stress Bench Analysis (SBA). - CTE_data_TMA: Data for CTE from thermomechanical analysis (TMA) of the material. - DR_data_MRC: Data for the Dielectric Response of the material using a non-contact Microwave Resonant Cavity (MRC) at 7 GHz. - MP_data_VSA: Data on the Moisture Properties (MP) of the material collected with an isothermal Vapor Sorption Analyzer. - RS_data_SBA: Residual Stress (RS) data from the SBA. For more details see the included documentation in the main folder and subfolders. |
| Modified | 2026-05-12 00:00:00 |
| Publisher Name | National Institute of Standards and Technology |
| Contact | mailto:[email protected] |
| Keywords | epoxy thermoset , thermal curing , moisture properties , coefficient of thermal expansion , residual stress , conversion prediction , cure kinetics |
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"title": "Data for Controlling the Reaction Pathway to Tune Packaging Epoxy Properties",
"description": "This repository contains data from multiple modalities used to study the effect of reaction conditions on the cure of a thermosetting epoxy. The material is a model thermoset system (TM01) of bisphenol F diglycidyl ether (DGEBF) epoxy resin and diethyl toluene diamine (DETDA) curing agent mixed in a stoichiometric ratio.\n\nData sources:\n\n- CP_data_CKM: Conversion Prediction (CP) data from the Cure Kinetics Modeling (CKM) of the reaction process, consisting of the exported data from the model results.\n\n- CP_data_DSC: Data from the Differential Scanning Calorimetry (DSC) scans on the uncured material. Reduced data in .xlsx files from DSC experiments.\n\n- CTE_data_DIC: Data for Coefficient of Thermal Expansion (CTE) from the digital image correlation (DIC) experiment, including DIC data output (.csv) and processed results (.mat).\n\n- CTE_data_SBA: Data for CTE from the Stress Bench Analysis (SBA).\n\n- CTE_data_TMA: Data for CTE from thermomechanical analysis (TMA) of the material.\n\n- DR_data_MRC: Data for the Dielectric Response of the material using a non-contact Microwave Resonant Cavity (MRC) at 7 GHz.\n\n- MP_data_VSA: Data on the Moisture Properties (MP) of the material collected with an isothermal Vapor Sorption Analyzer.\n\n- RS_data_SBA: Residual Stress (RS) data from the SBA.\n\nFor more details see the included documentation in the main folder and subfolders.",
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"name": "National Institute of Standards and Technology"
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"residual stress",
"conversion prediction",
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}
