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Data for Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging

The data are associated with figures in R. Giang, R. Tao,*, E. Moukhina, A. L. Forster, T. J. Cho, P. Centellas, S. Romberg, Z. Tsinas, C. Soles, Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging, Journal of Polymer Science 2026, https://doi.org/10.1002/pola.70283

About this Dataset

Updated: 2026-09-04
Metadata Last Updated: 2026-07-24 00:00:00
Date Created: N/A
Data Provided by:
Dataset Owner: N/A

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Table representation of structured data
Title Data for Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging
Description The data are associated with figures in R. Giang, R. Tao,*, E. Moukhina, A. L. Forster, T. J. Cho, P. Centellas, S. Romberg, Z. Tsinas, C. Soles, Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging, Journal of Polymer Science 2026, https://doi.org/10.1002/pola.70283
Modified 2026-07-24 00:00:00
Publisher Name National Institute of Standards and Technology
Contact mailto:[email protected]
Keywords advanced electronic packaging , cure kinetics , differential scanning calorimetry , diffusion-controlled reaction , epoxy underfill , isoconversional analysis , thermal endurance , thermogravimetric analysis , vitrification
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