{
    "identifier": "ark:\/88434\/mds2-3702",
    "accessLevel": "public",
    "contactPoint": {
        "hasEmail": "mailto:[email protected]",
        "fn": "Anthony Kotula"
    },
    "programCode": [
        "006:045"
    ],
    "landingPage": "https:\/\/data.nist.gov\/od\/id\/mds2-3702",
    "title": "Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant",
    "description": "The data are associated with figures in A. P. Kotula, R. Tao, J. Tu, Y. Lee, G. A. Holmes, Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant, 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, Texas, May 27 - 30, 2025.",
    "language": [
        "en"
    ],
    "distribution": [
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-3702\/Figure%201-Conversion%20rate.xlsx",
            "mediaType": "application\/vnd.openxmlformats-officedocument.spreadsheetml.sheet"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-3702\/Figure%202-Conversion.xlsx",
            "mediaType": "application\/vnd.openxmlformats-officedocument.spreadsheetml.sheet"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-3702\/Figure%203-Residue%20heat.xlsx",
            "mediaType": "application\/vnd.openxmlformats-officedocument.spreadsheetml.sheet"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-3702\/Figure%204-FTIR%20spectra.xlsx",
            "mediaType": "application\/vnd.openxmlformats-officedocument.spreadsheetml.sheet"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-3702\/Figure%206-Raman%20spectra.xlsx",
            "mediaType": "application\/vnd.openxmlformats-officedocument.spreadsheetml.sheet"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-3702\/Figure%207-Rheo-Raman%20data.xlsx",
            "mediaType": "application\/vnd.openxmlformats-officedocument.spreadsheetml.sheet"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/ark:\/88434\/mds2-3702\/3702_README.txt",
            "mediaType": "text\/plain"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/ark:\/88434\/mds2-3702\/3702_README.txt.sha256",
            "mediaType": "text\/plain"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/ark:\/88434\/mds2-3702\/Figure_5-Normalized_IR_absorbance.xlsx",
            "mediaType": "application\/vnd.openxmlformats-officedocument.spreadsheetml.sheet"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/ark:\/88434\/mds2-3702\/Figure_5-Normalized_IR_absorbance.xlsx.sha256",
            "mediaType": "text\/plain"
        },
        {
            "accessURL": "https:\/\/pages.nist.gov\/CHIPS-AWACKSM-data",
            "description": "The CADRE website provides an access point to the project\u2019s published datasets. It aims to provide researchers a means to quickly understand the scope of the work and explore data relevant to semiconductor packaging materials and processing.",
            "title": "CHIPS-AWACKSM Data Repository Explorer (CADRE)"
        }
    ],
    "bureauCode": [
        "006:55"
    ],
    "modified": "2025-02-10 00:00:00",
    "publisher": {
        "@type": "org:Organization",
        "name": "National Institute of Standards and Technology"
    },
    "theme": [
        "Chemistry:Chemical thermodynamics and chemical properties",
        "Chemistry:Thermochemical properties",
        "Chemistry:Chemical engineering and processing",
        "Chemistry:Analytical chemistry",
        "Materials:Composites",
        "Materials:Polymers",
        "Materials:Materials characterization",
        "Metrology:Optical, photometry, and laser metrology"
    ],
    "keyword": [
        "microelectronics encapsulation",
        "optoelectronics",
        "cure kinetics",
        "rheology",
        "advanced packaging",
        "CHIPS metrology"
    ]
}