{
    "identifier": "ark:\/88434\/mds2-3867",
    "accessLevel": "public",
    "contactPoint": {
        "hasEmail": "mailto:[email protected]",
        "fn": "Gheorghe Stan"
    },
    "programCode": [
        "006:045"
    ],
    "landingPage": "https:\/\/data.nist.gov\/od\/id\/mds2-3867",
    "title": "Elastic-plastic AFM indentation on copper",
    "description": "Dataset from AFM single-step and multi-step indentations performed on hybrid-bonding copper patterns at room temperature",
    "language": [
        "en"
    ],
    "distribution": [
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-3867\/Data_Figure_1.csv",
            "format": "csv",
            "description": "Representative experimental curves obtained by i) Contact Resonance AFM (CR-AFM), ii) single-step, and iii) multi-step AFM indentation.",
            "mediaType": "text\/csv",
            "title": "Data for Figure 1"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-3867\/Data_Figure_2.csv",
            "format": "csv",
            "description": "CR-AFM measurements. (i) Indentation moduli over SiO2 and Cu regions as determined from CR-AFM mapping; (ii) Cross-section along the dashed line in (i); (iii) Histogram of the indentation moduli from the map shown in (a).",
            "mediaType": "text\/csv",
            "title": "Data for Figure 2"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-3867\/Data_Figure_3.csv",
            "format": "csv",
            "description": "AFM single-step indentation characterization on Cu pads. (a) Characteristic force-displacement curve; (b) Average force-indentation depth curves, with one standard deviation; (c) Histogram fits for plastic metrics: number of pop-ins per indentation curve, plasticity index, cumulative excursion length, and plastic work; (d) Empirical cumulative distribution (ecdf) of maximum shear stress at the first pop-in event.",
            "mediaType": "text\/csv",
            "title": "Data for Figure 3"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-3867\/Data_Figure_4.csv",
            "format": "csv",
            "description": "AFM single-step indentation comparison of grain boundary (GBdry) and grain interior (GInt) plasticity. (i) Average force-indentation depth curves; (ii) Histogram fits for plastic metrics (number of pop-ins per indentation curve, plasticity index, cumulative excursion length, plastic work); (iii) Empirical cumulative distribution (ecdf) of maximum shear stress at fist pop-in.",
            "mediaType": "text\/csv",
            "title": "Data for Figure 4"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-3867\/Data_Figure_5.csv",
            "format": "csv",
            "description": "Multi-step AFM-indentation experiments. (i) Topographic line scan covering two indents within a Cu pad; (ii) A subset of force-indentation depth curves with the Hertzian fits superimposed on the unloading segments; (iii) Indentation stress-strain curve with stress-strain pairs from all experiments; (iv) Empirical cumulative distribution function of the indentation yield stress from all the experiments; (v) Average force-depth envelope curve for multi-step indentation experiments.",
            "mediaType": "text\/csv",
            "title": "Data for Figure 5"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-3867\/3867_README.txt",
            "mediaType": "text\/plain",
            "title": "3867_README"
        }
    ],
    "bureauCode": [
        "006:55"
    ],
    "modified": "2025-06-25 00:00:00",
    "publisher": {
        "@type": "org:Organization",
        "name": "National Institute of Standards and Technology"
    },
    "theme": [
        "Nanotechnology:Nanometrology",
        "Nanotechnology:Nanomechanics",
        "Materials:Metals",
        "Materials:Materials characterization",
        "Electronics:Semiconductors"
    ],
    "keyword": [
        "AFM",
        "indentation",
        "contact resonance",
        "nanoscale plasticity",
        "copper",
        "advanced packaging",
        "hybrid bonding"
    ]
}