{
    "identifier": "ark:\/88434\/mds2-2918",
    "accessLevel": "public",
    "contactPoint": {
        "hasEmail": "mailto:[email protected]",
        "fn": "Stian Romberg"
    },
    "programCode": [
        "006:045"
    ],
    "@type": "dcat:Dataset",
    "landingPage": "https:\/\/data.nist.gov\/od\/id\/mds2-2918",
    "description": "Thermoset composite structures printed at room temperature using direct ink writing often collapse during thermal post-curing. This behavior suggests that the rheological properties that govern structural stability (i.e., storage modulus and\/or yield stress) are sensitive to both temperature and conversion. The rheo-Raman instrument provides a way to directly link rheological properties, temperature, and conversion. Using this technique, we characterized how the yield stress and storage modulus evolve as a function of conversion at different temperatures and filler contents of fumed silica. This data set focuses on a diglycidyl ether of bisphenol A (DGEBA) epoxy resin (Epon 826, Hexion, Ohio, USA) cured with Jeffamine D-230 (Huntsman Corporation, Texas, USA). Three resins with fumed silica (Cabot Corporation, Massachusetts, USA) mass fractions of 0 %, 5 %, and 10 % were cured and observed isothermally at 70 \u00b0C and 100 \u00b0C. Rheological and Raman data were obtained, analyzed, and then combined to determine how the yield stress and storage modulus evolve with conversion at different temperatures. These results motivated a two-step schedule designed to prevent a reduction in rheological properties during curing while quickly driving the reaction to high conversion. The two-step schedule began at 70 \u00b0C then ramped to 100 \u00b0C and is also included in this dataset. This data is described in: Romberg, S.K., & Kotula, A.P. (2023) Simultaneous rheology and cure kinetics dictate thermal post-curing of thermoset composite resins, National Institute of Standards and Technology, submitted for publication.",
    "language": [
        "en"
    ],
    "title": "Simultaneous rheology and cure kinetics dictate thermal post-curing of thermoset composite resins for material extrusion",
    "distribution": [
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-2918\/README.txt",
            "format": "text",
            "description": "This text file describes the files in the dataset.",
            "mediaType": "text\/plain",
            "title": "README"
        },
        {
            "downloadURL": "https:\/\/data.nist.gov\/od\/ds\/mds2-2918\/ALL%20DATA.zip",
            "format": "zip",
            "description": "This zip file includes all of the data described in the README file.",
            "mediaType": "application\/x-zip-compressed",
            "title": "Dataset - Simultaneous rheology and cure kinetics dictate thermal post-curing of thermoset composites for material extrusion"
        }
    ],
    "license": "https:\/\/www.nist.gov\/open\/license",
    "bureauCode": [
        "006:55"
    ],
    "modified": "2023-01-30 00:00:00",
    "publisher": {
        "@type": "org:Organization",
        "name": "National Institute of Standards and Technology"
    },
    "accrualPeriodicity": "irregular",
    "theme": [
        "Manufacturing",
        "Physics:Spectroscopy",
        "Metrology:Flow metrology and rheology",
        "Materials:Polymers",
        "Materials:Composites",
        "Materials",
        "Manufacturing:Additive manufacturing"
    ],
    "issued": "2023-03-07",
    "keyword": [
        "rheo-Raman",
        "thermoset composite",
        "yield stress fluid",
        "cure kinetics",
        "direct ink writing",
        "thermal post-cure"
    ]
}