The data are associated with figures in R. Giang, R. Tao,*, E. Moukhina, A. L. Forster, T. J. Cho, P. Centellas, S. Romberg, Z. Tsinas, C. Soles, Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging, Journal of Polymer Science 2026, https://doi.org/10.1002/pola.70283

Design files and data for NIST Standard Reference Material (SRM) 2169, Scale and Distortion Standard for Forensic Topographic Surface Measurement. The designs for the SRM chip
and the post are provided in [FreeCAD](freecad.org) format, and in STEP format. A fabrication drawing is included for the SRM post.

Electron tomography tilt series data, reconstruction, and data processing code for three-dimensional imaging of a gate-all-around (GAA) transistor layer extracted from a commercially available chip.

This data was collected on July 21, 2025.

ABS collects information about individual attendance and involvement in the arts and cultural activity.

This dataset contains data to support the publication, "Understanding Reporting Variability in Fire Debris Data Interpretation through an Interlaboratory Study".

Included in this dataset is:
- Full set of processed data from the interlaboratory study
- Information on instrumental methods used to collect spectral data
- Copies of the interlaboratory study instruction sheet and survey form
- Raw datafiles for all unknown samples, neat ignitable liquids, and control samples

ABS collects information about individual attendance and involvement in the arts and cultural activity.

The CHIPS Metrology Ontology originated from a pragmatic desire to understand how the various research entities under the CHIPS Metrology described by the Seven Grand challenges (https://doi.org/10.6028/nist.chips.1000), are related to each other. The named classes within this ontology came from the data management plans and adjacent documents associated with the projects within the Severn Grand Challenges. The class hierarchy was mainly assembled by June Lau.

This dataset supports the manuscript “Does aging alter the strain-rate response of PPTA body armor fibers? A paired single-filament investigation”. The study examined two related questions: whether the relationship between quasi-static (QS) and high strain rate (HSR) tensile properties of poly(p-phenylene terephthalamide) (PPTA) fibers is preserved during accelerated aging and whether QS-based tensile inputs remain reliable for predicting ballistic-performance degradation.

SIPP is a nationally representative longitudinal survey that provides comprehensive data about the income and government program participation of individuals and households in the United States. These microdata contain demographic and social characteristic information for each sample member, as well as detailed data on labor force activity, types and amounts of income, and participation in various cash and noncash benefit programs.

The Annual Integrated Economic Survey (AIES) consolidates seven existing annual business surveys into one, replacing the Annual Capital Expenditures Survey, Annual Retail Trade Survey, Annual Survey of Manufacturers, Annual Wholesale Trade Survey, Manufacturer's Unfilled Orders Survey, Report of Organization, and Services Annual Survey. AIES will provide comprehensive national and subnational data on business revenues, expenses, and assets, using the North American Industry Classification System (NAICS).